ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,751, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,751, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,752, issued on April 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor die package" was invented by ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,752, issued on April 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor die package" was invented by ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,753, issued on April 14, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea). "Metal clip applied to power module" was invented by... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,753, issued on April 14, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea). "Metal clip applied to power module" was invented by... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,754, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with non-uniform interconnect features" wa... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,754, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with non-uniform interconnect features" wa... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,755, issued on April 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device interconnects formed through volumet... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,755, issued on April 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device interconnects formed through volumet... Read More